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heat-activated-bonding-films


PLI-BONDTM Heat Activated Bonding Film

PLI-BONDTM is a high performance thermoplastic adhesive system which is primarily used in the smart/sim card manufacturing process for high-performance bonding of the memory module to the card body. PLI-BONDTM is also suitable for other applications requiring strong bonds to metal, plastic, and woven materials.

PLI-BONDTM Features

  • High-performance bonding
  • Eliminates liquid adhesive mess
  • Available in custom widths & lengths

PLI-BONDTM Applications

  • Smart Cards & Sim Card Manufacturing
  • Mobile phone assembly
  • Flexible circuit assembly
  • Sheet metal splicing
  • Fabrics
Smart Card