PLI-BOND^TM Heat Activated Bonding Film

PLI-BOND^TM is a high performance thermoplastic adhesive system which is primarily used in the smart/sim card manufacturing process for high-performance bonding of the memory module to the card body. PLI-BOND^TM is also suitable for other applications requiring strong bonds to metal, plastic, and woven materials.

PLI-BONDTM Features High-performance bonding Eliminates liquid adhesive mess Available in custom widths & lengths PLI-BONDTM Applications Smart Cards & Sim Card Manufacturing Mobile phone assembly Flexible circuit assembly Sheet metal splicing Fabrics